SMD Dizgi

MELSiS – Mikro Elektronik Sistemler Ltd. Şti. Tam otomatik dizgi hattı ile elektronik kart üretimi ve SMD dizgi hizmeti sunmaktadır.

SMD dizgilerimiz; ESD kontrollü alanda, IPC-A-610 & IPC J-STD-001 eğitimleri alan personelimiz ile IPC-A-610 & IPC J-STD-001 standartlarına uygun olarak dizgi atölyemizde gerçekleştirilmektedir. Seri ve prototip üretimde tek veya çift yüzlü elektronik kartları siz değerli müşterilerimize hızlı ve kaliteli bir şekilde sunabilmekteyiz.

SAMSUNG SM482 SMD makinamız ve full otomatik hattımız günde 350.000 malzeme, dip dizgide günlük 5000 malzeme dizme kapasitesine sahiptir.

SMD dizgide müşteri talebine göre kurşunlu ya da kurşunsuz olarak lehimleme işlemi gerçekleştirilmektedir.

Üretim Altyapısı

  • Dizilebilen Komponentler 01005, 0201,0402, BGA, QFP, QFN, CSP (0,3 mm pitch)
  • X-Ray ile Lehimleme Kontrolü
  • Yıkama işlemi
  • Otomatik Optik Kontrol (AOI) ile kartların kontrolü
  • Komponentler için lehimleme ve sökme cihazları
  • Yaşlandırma Kabini ile Isıl Testler
  • Mekanik montaj

SMD Dizgi

Dizgi Hattımız

Teknik Özellikler

Samsung SM482 SMD Machine

  • 28000 cph (champion speed)
  • 1 gantry x 6 spindle
  • Component range : 0603 mm (0201 inch) 55x55 mm (H:15mm) 01005 inch (0402 mm) (option) 75 mm connector (BGA, micro BGA, QFP, QFN, CSP components) (0.3 mm pitch)
  • PCB Size : 460 (L) x 400 (W) (Standard)
  • PCB Size : 510 (L) x 460 (W) (Option)
  • PCB Size : 610 (L) x 510 (W) (Option)
  • PCB Size : 740 (L) x 460 (W) (Option)
  • High speed, high precision and electirically driven feeder
  • Automatic Pick-Up position alignment function
  • Compatible with SM pneumatic feeders
  • New vacuum system and optimized pickup/placement motion
  • The world's first auto splicing and auto loading

Haller 1707 MARK III Reflow Soldering

  • Pure forced covection heating
  • Advanced Windows operating system with Data logging. Alarm Logging and GEM/Secs host computer ingterfacecing option
  • 5 T/C Profiling with KIC or ECD software
  • Signal light tower
  • Calender startup
  • 350© operating temperatures
  • 350© and 400© option
  • Edge hold conveyor/ Mesh mesh belt option
  • Nitrogen retrofit option
  • RMATS n Remote monitoring and tecnical Support option
  • UL/CE configiration option
  • Leod-Free processing capability
  • Dual edge hold conveyor option

Speedprint Sp700Avi

  • Max board size 610mm(x) by 508mm(y)
  • Min board size 45mm x 45mm
  • Maximum PCB weight 1Kg (2.2lb)
  • Underside component clearance 3-15mm *30mm
  • Underside edge clearance 5mm
  • Minimum board edge clearance 3mm
  • Alignment Repeatability 20um@6Sigma 2cpk
  • Max print area 610mm(x)x 508mm(y)
  • Max PCB thickness Up to 8mm (0.2i) including 1% warpage
  • Min PCB Thickness 0.3 mm
  • X/Y PCB Alignment ± 5mm
  • Stencil image Front and centre dedicated
  • Stencil load/unload Automatic usin print head
  • Stencil frame size (max)736.6mm(29i) x 736.6mm(29i) max fame height 40mm
  • Stencil frame size (min)584.2mm(23i) x 584mm(23i) max fame height 40mm
  • Squeegees Metal or Polyurethane
  • Squeegees pressure 1-20kg
  • Squeegees control Pneumatic using proportional valve
  • Print speed 5-250mm/sec
  • PCB separation speed 0.1-20mm/sec
  • Print modes Print/print,flood/print,print/flood
  • Transfer heigh 939.8mm(37i)n 965.2mm(38i)

Flexi 300 Series

  • Flexi Lead-Free Wave Soldering Machine
  • Faetures of Flexi 300 Series
  • Working width : 350mm
  • Total Pre-Heating Total Length: 1.800mm
  • Solder Pot Capacity: 300kg
  • Fluxer Type:Nozzle Spray

PBT Mini SWASH

  • Small footprint
  • Quick loading
  • Short cycle time
  • Complete drying
  • Clamping for all types of stencils
  • Wide range of PCBA fixtures
  • Wide range of standard fixtures and adaptors for other types of stencils and PCBAs
  • PBT Works can additionally custom design any special clamping fixture required
  • Slide-in adaptor for Dek VectorGuard stencil
  • Measures and displays all main process parametres (time, temperature, pressure, conductivity-resistance)

Quadra3 X-ray Inspection System

  • High quality X-ray inspection for production applications
  • inspection at high magnification for quality control of production applications.
  • Detect a wide range of manufacturing defects including BGA, QFN and IGBT attachment, PTH filling, interfacial voiding, component cracking and counterfeit devices.
  • Easily ensure IPC compliance with automatic measurement and voiding analysis that gives clear pass/fail results.
  • 4-way split screen view makes identification and comparison easy.
  • See the Finest Details Clear, easy to interpret images show defects fast.